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MAX8884Y डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - 700mA DC-DC Step-Down Converters - Maxim Integrated Products

भाग संख्या MAX8884Y
समारोह 700mA DC-DC Step-Down Converters
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX8884Y?> डेटा पत्रक पीडीएफ

MAX8884Y pdf
700mA DC-DC Step-Down Converters
with Dual 300mA LDO in 2mm x 2mm CSP
ABSOLUTE MAXIMUM RATINGS
IN1A, IN1B, IN2, REFBP to AGND ........................-0.3V to +6.0V
FB to PGND ...........................................................-0.3V to +6.0V
SEL, BUCK_EN to AGND...............-0.3V to (VIN1A/VIN1B + 0.3V)
LDO1, LDO2, LDO1_EN, LDO2_EN
to AGND.................................................-0.3V to (VIN2 + 0.3V)
IN2 to IN1A, IN1B ..................................................-0.3V to +0.3V
AGND to PGND .....................................................-0.3V to +0.3V
IN1A, IN1B, LX Current .....................................................1ARMS
Continuous Power Dissipation (TA = +70°C)
16-Bump CSP (derate 12.5mW/°C above +70°C) ..............1W
Operating Temperature .......................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature*.........................................................+260°C
*These ICs are constructed using a unique set of packaging techniques imposing a limit on the thermal profile used during board level
solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification,
JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN1A = VIN1B = VIN2 = VLDO1_EN = VLDO2_EN = VBUCK_EN = 3.6V. TA = -40°C to +85°C, typical values are at TA = +25°C, unless
otherwise noted.) (Note 1)
PARAMETER
INPUT SUPPLY
Input Voltage
Input Undervoltage Threshold
Shutdown Supply Current
No-Load Supply Current
THERMAL PROTECTION
Thermal Shutdown
LOGIC CONTROL
Logic Input-High Voltage
(BUCK_EN, SEL, LDO1_EN,
LDO2_EN)
CONDITIONS
VIN1A, VIN1B, VIN2
VIN1A, VIN1B, VIN2 rising, 180mV typical hysteresis
VBUCK_EN = VLDO1_EN =
VLDO2_EN = 0
TA = +25°C
TA = +85°C
VBUCK_EN = 0, ILDO1 = ILDO2 = 0A
VLDO1_EN = VLDO2_EN = 0, IBUCK = 0A, no switching
TA rising, 20°C typical hysteresis
2.7V  VIN1A = VIN1B = VIN2  5.5V
MIN TYP MAX UNITS
2.7
2.52
2.63
0.1
0.1
140
50
5.5
2.70
4
230
80
V
V
µA
µA
µA
+160
°C
1.3 V
Logic Input-Low Voltage
(BUCK_EN, SEL, LDO1_EN,
LDO2_EN)
Logic Input Current (BUCK_EN,
SEL, LDO1_EN, LDO2_EN)
FB
Buck Converter Output Voltage
FB Leakage Current
LX
On-Resistance
2.7V  VIN1A = VIN1B = VIN2  5.5V
VIL = 0 or VIH = VIN1A = 5.5V
TA = +25°C
TA = +85°C
SEL = AGND, IBUCK = 0A
VSEL = VIN1A, IBUCK = 0A
VIN1A = VIN1B = VIN2 = 5.5V,
VFB = 0
TA = +25°C
TA = +85°C
p-channel MOSFET switch, ILX = -40mA
n-channel MOSFET rectifier, ILX = 40mA
0.4
0.01 1
0.1
1.18 1.22 1.24
1.78 1.80 1.85
0.01 1
1
0.18 0.30
0.15 0.25
V
µA
V
V
µA

2 _______________________________________________________________________________________

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