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MAX8939B डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - System Power Management - Maxim Integrated

भाग संख्या MAX8939B
समारोह System Power Management
मैन्युफैक्चरर्स Maxim Integrated 
लोगो Maxim Integrated लोगो 
पूर्व दर्शन
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<?=MAX8939B?> डेटा पत्रक पीडीएफ

MAX8939B pdf
MAX8939/MAX8939A/MAX8939B
System Power Management
for Mobile Handset
ABSOLUTE MAXIMUM RATINGS
BATT, OUT1, SAFE_OUT, and INVIB to AGND.....-0.3V to +6.0V
CHG_IN, OUT2, LED1, and LED2 to AGND..........-0.3V to +30V
LED3 and CHG_MON to AGND..... -0.3V to (VSAFE_OUT + 0.3V)
COMP2, IRQ, RESET_IN, COMP1, SCL, SDA, CHG,
PWR_ON_CMP, REF, LDO1, LDO2, LDO3, LDO4,
and LDO1_EN to AGND..................... -0.3V to (VBATT + 0.3V)
OUTVIB to AGND................................... -0.3V to (VINVIB + 0.3V)
PGND1 and PGND2 to AGND..............................-0.3V to +0.3V
LX1, LX2 Current (Note 1).............................................. 1.7ARMS
Continuous Power Dissipation (TA = +70NC)
WLP (derate 24.4mW/NC above +70NC)..........................1.9W
Operating Temperature....................................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Soldering Temperature (reflow).......................................+260NC
Note 1: LX1 has internal clamp diodes to PGND1 and OUT1. LX2 has internal clamp diodes to PGND2 and OUT2. Applications
that forward bias these diodes should take care not to exceed the IC package power dissipation limit.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
WLP
Junction-to-Ambient Thermal Resistance (qJA)...........41°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS (Note 3)
(VBATT = 3.7V, VCHG_IN = 5.0V, circuit of Figure 1, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
PARAMETER
BATT
BATT Operating Voltage
BATT Shutdown Supply Current
BATT Standby Supply Current
BATT Biasing Supply Current
Undervoltage Lockout (UVLO)
Threshold
Undervoltage Lockout Hysteresis
THERMAL SHUTDOWN
Threshold
Hysteresis
REFERENCE
Reference Output Voltage
Reference Supply Rejection
LOGIC AND CONTROL INPUTS
Input Low Level
Input High Level
Logic-Input Current
CONDITIONS
All outputs off, I2C disabled,
TA = +25NC
VSCL = VSDA= VRESET_IN = 0V TA = +85NC
All outputs off, VSCL = VSDA =
VRESET_IN = 1.8V, I2C ready
TA = +25NC
TA = +85NC
I2C ready, one or more outputs on
BATT rising
SDA, SCL, LDO1_EN, CHG, and RESET_IN
SDA, SCL, LDO1_EN, CHG, and RESET_IN
SDA, SCL, LDO1_EN, CHG,
TA = +25NC
and RESET_IN, 0 < VIN < 5.5V TA = +85NC
MIN TYP MAX UNITS
2.9
0.4
0.4
5
5
60
2.6 2.75
100
5.5
1
1
10
2.9
V
FA
FA
FA
V
mV
+160
20
NC
NC
1.200
0.2
V
mV
0.4 V
1.40
V
-1
0.1
+1
FA
2   Maxim Integrated

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