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MAX17541G डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Synchronous Step-Down DC-DC Converter - Maxim Integrated

भाग संख्या MAX17541G
समारोह Synchronous Step-Down DC-DC Converter
मैन्युफैक्चरर्स Maxim Integrated 
लोगो Maxim Integrated लोगो 
पूर्व दर्शन
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<?=MAX17541G?> डेटा पत्रक पीडीएफ

MAX17541G pdf
MAX17541G
42V, 500mA, Ultra-Small, High-Efficiency,
Synchronous Step-Down DC-DC Converter
Absolute Maximum Ratings
VIN to GND.............................................................-0.3V to +48V
EN/UVLO to GND.......................................-0.3V to (VIN + 0.3V)
LX to PGND................................................-0.3V to (VIN + 0.3V)
FB, RESET, COMP, SS to GND..............................-0.3V to +6V
VCC to GND..............................................................-0.3V to +6V
GND to PGND.......................................................-0.3V to +0.3V
LX Total RMS Current......................................................... ±1.6A
Output Short-Circuit Duration.....................................Continuous
Junction Temperature......................................................+150°C
Storage Temperature Range............................. -65°C to +160°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Junction temperature greater than +125°C degrades operating lifetimes.
Package Thermal Characteristics (Note 1)
10 TDFN
C o(ndteinrautoeu1s4P.9omwWer/D°Cissaibpoavtieon+7(T0A°C=)
+70°C)
(multilayer
board).1188.7mW
Junction-to-Ambient Thermal Resistance (θJA)............67.3°C/W
Junction-to-Case Thermal Resistance (θJC).................18.2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN = 24V, VGND = VPGND = 0V, CVIN = 1μF, CVCC = 1μF, VEN = 1.5V, CSS = 3300pF, VFB = 0.98 x VOUT, LX = unconnected, RESET
= unconnected. TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND,
unless otherwise noted.) (Note 2)
PARAMETER
INPUT SUPPLY (VIN)
Input Voltage Range
Input Supply Current
ENABLE/UVLO (EN/UVLO)
EN Threshold
EN Input Leakage Current
LDO
VCC Output Voltage Range
VCC Current Limit
VCC Dropout
VCC UVLO
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
VIN
IIN-SH
IIN-SW
VEN = 0V, shutdown mode
Normal switching mode, no load
VENR
VENF
VEN-TRUESD
IEN
VEN rising
VEN falling
VEN falling, true shutdown
VEN = VIN = 42V, TA = +25°C
4.5 42 V
0.9 3.5 µA
4.75 6.75
mA
1.194
1.114
1.218
1.135
0.7
8
1.236
1.156
200
V
nA
VCC
6V < VIN < 12V, 0mA < IVCC < 10mA,
12V < VIN < 42V, 0mA < IVCC < 2mA
4.65
5
5.35
V
IVCC-MAX VCC = 4.3V, VIN = 12V
15 40 80 mA
VCC-DO VIN = 4.5V, IVCC = 5mA
4.1
V
VCC-UVR
VCC-UVF
VCC rising
VCC falling
3.85 4 4.15
3.55 3.7 3.85
V
www.maximintegrated.com
Maxim Integrated 2

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